Reflow Reballing
In the remelting technique, electronic components are subjected to a controlled reflow process. During this process, new solder balls are melted onto the contact surfaces, or 'pads'.
Reballing is essential for restoring the electrical and mechanical integrity of components, particularly when the original solder joints are damaged or compromised by thermal stress.
Restoring connection quality requires the highest level of precision in terms of both placement and thermal profile.
Features:
- Despite the growing importance of laser-assisted processes that do not subject components to thermal stress, reflow reballing remains a reliable and cost-effective standard process.
- It is particularly suitable for applications requiring robust connection technology where an additional reflow cycle can be carried out without risk to the component.